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Typical Application Fields
| Application Field | Specific Components | Key Requirements |
| Power Semiconductors | IGBT modules, SiC MOSFET modules | High thermal conductivity, High voltage resistance, Thermal shock resistance |
| High-Frequency Connectors | High-speed backplanes, RF connectors | Low dielectric loss (Df), Dimensional stability, High-frequency performance |
| Automotive Electronics | Electronic Control Units (ECU), Sensors | High-temperature resistance, Oil resistance, Vibration resistance |
| Aerospace & Defense | Flight controllers, Radar components | Extreme temperature resistance, Radiation resistance, Lightweight |
| New Energy | Photovoltaic inverters, On-board chargers | High insulation, Weather resistance, Long service life |
Technological Frontiers
1. High-Performance Composite Materials
Nano-Modified PI: Incorporates nano-Al₂O₃/Si₃N₄, thermal conductivity >1.5 W/m·K.
Carbon Fiber Reinforced PI: Tensile strength >500 MPa, used for structural load-bearing parts.
Low-Dk PI: Dielectric constant <2.8 @ 10 GHz, for 5G/millimeter-wave applications.
2. Advanced Molding Technologies
LDS (Laser Direct Structuring): Forms circuit patterns directly on frame surface for integrated design.
Microcellular Foam Molding: Reduces weight by 10%-20%, lowers dielectric constant.
Insert Molding: Integrates metal components in one shot, reducing assembly.
3. Functional Surface Treatments
Plasma Activation: Improves adhesion to epoxy resins.
Metallization: Electroless/electroplating for EMI shielding.
Hydrophobic Coating: Enhances resistance to wet tracking.
Frame Types and Structures
| Frame Type | Structural Features | Primary Material | Typical Process |
| Power Module Frame | Power Module Frame | PI + 40% Glass Fiber + Thermal fillers | Injection/Compression Molding |
| Injection/Compression Molding | Precision pin holes, thin walls | PI + 30% Glass Fiber | Precision Injection Molding |
| Bobbin/Coil Former | Wire grooves, flanges | PI + Mineral fillers | Injection Molding |
| Chip Carrier/Substrate | High flatness requirements | Pure PI or low-filler PI | Lamination & Machining |
| Socket Base | Multi-pin positioning | PI + 15% GF + Lubricant | Injection Molding |
| Injection Molding | Large creepage/clearance distance | PI + High tracking resistance filler | Compression Molding |
Key Performance Parameter Table
| Performance Indicator | Pure PI | PI + 30% GF | PI + 40% GF + Al₂O₃ | Test Standard |
| Density (g/cm³) | 1.42 - 1.45 | 1.65 | 1.85 | ASTM D792 |
| Tensile Strength (MPa) | 100 - 120 | 160 - 200 | 140 - 180 | ASTM D638 |
| Flexural Strength (MPa) | 150 - 180 | 240 - 280 | 220 - 260 | ASTM D790 |
| Flexural Modulus (GPa) | 3.0 - 3.5 | 8.0 - 10.0 | 9.0 - 11.0 | ASTM D790 |
| Heat Deflection Temp. (°C) | >360 | >350 | >340 | ASTM D648 |
| Thermal Conductivity (W/m·K) | 0.1 - 0.2 | 0.3 - 0.4 | 1.0 - 1.5 | ASTM E1461 |
| CTE (×10⁻⁶/°C) | 45 - 55 | 15 - 25 | 12 - 20 | ASTM E831 |
| Dielectric Strength (kV/mm) | >300 | >280 | >250 | ASTM D149 |
Electrical Performance Table
| Performance Indicator | Test Conditions | Typical Value | Significance |
| Volume Resistivity (Ω·cm) | 23°C, 50% RH | >10¹⁶ | Insulation reliability |
| Surface Resistance (Ω) | 23°C, 50% RH | >10¹⁵ | Prevents leakage current, tracking |
| Dielectric Constant (Dk) | 1 MHz | 3.2 - 3.5 | Signal transmission speed |
| Dissipation Factor (Df) | 1 MHz | 0.001 - 0.003 | High-frequency heating |
| Comparative Tracking Index (CTI) | IEC 60112 | >600 V | Insulation under humid conditions |
| High Voltage Arc Tracking Rate (HVTR) | ASTM D495 | >180 sec | Resistance to short-circuit arcing |
Application Selection Guide
| Application Scenario | Recommended Material | Recommended Material | Typical Service Life |
| IGBT Module | PI + 40% GF + Al₂O₃ | Thermal conductivity >1.0 W/m·K, CTI >600 V | 10-15 years |
| Automotive ECU Connector | PI + 30% GF | 150°C resistance, Vibration resistance, Dimensional stability | Vehicle lifetime |
| 5G Base Station RF | Low-Dk PI | Dk <3.0 @ 10GHz, Df <0.003 | 10 years |
| Spacecraft Electronics | Pure PI / Carbon Fiber PI | -180°C to +200°C resistance, Radiation resistance | Mission duration |
| Industrial Motor Drive | PI + Mineral filler | Corona resistance, CTI >600 V | 8-10 years |
| Oil Well Logging Tool | PI + Special fillers | 200°C & high pressure resistance, H₂S resistance | 3-5 years |
| Consumer Fast Charger | PI + 15% GF | Solder reflow temperature resistance, UL94 V-0 | 3-5 years |
Special Functional PI Frames
| Product Type | Special Technology | Functional Features | Main Applications |
| High Thermal Conductivity Frame | BN/AIN filler | Thermal conductivity >2.0 W/m·K | High-power density modules |
| LDS (Laser Direct Structuring) Frame | LDS additive | Forms conductive circuits on surface | Integrated antennas, 3D circuits |
| EMI Shielding Frame | Metal fibers/coating | Shielding effectiveness >30 dB | High-frequency sensitive circuits |
| Corona Resistant Frame | Nano-clay/mica | Improves corona resistance life by 10x | Inverter motors, HF transformers |
| Low CTE Frame | Carbon fiber/quartz fiber | CTE <10×10⁻⁶/°C | Optical communication, Precision sensors |
| Radome/ RF Transparent Frame | Special resin system | High microwave transmittance | Radar radomes, RF windows |
| Halogen-Free Flame Retardant Frame | Phosphorus-Nitrogen flame retardants | UL94 V-0, Halogen-free | Green electronics |
Industry Standards & Certifications
| Standard System | Relevant Standards | Certification Requirements | Applicable Industries |
| Electrical Safety | UL 94, IEC 60664 | Flame retardant rating, Insulation coordination | All electronics |
| Automotive Electronics | AEC-Q200 | Stress test qualification | Automotive |
| Aerospace & Defense | MIL-P-46179 | Comprehensive performance testing | Aerospace, Military |
| Semiconductor | Semiconductor | Moisture Sensitivity Level (Typically Level 1) | Power modules |
| Environmental Management | RoHS, REACH | Hazardous substance restrictions | Global market |
| Quality Management | IATF 16949, AS9100 | System certification | Automotive, Aerospace |
Future Development Trends
1. Higher Frequency Applications: Developing PI with Dk <2.7, Df <0.002 for terahertz fields.
2. Higher Thermal Conductivity Needs: Pursuing thermal conductivity >3 W/m·K for next-generation power devices.
3. Greener & More Sustainable: Bio-based PI, halogen-free and phosphorus-free flame-retardant systems.
4. Intelligent Integration: Co-molding with sensors and circuits.
5. Additive Manufacturing Applications: Breakthroughs in PI 3D printing for rapid prototyping and small batches.
PI electronic component insulating frames/carriers hold an irreplaceable position in high-end electronics due to their unique combination of high-temperature resistance, excellent electrical insulation, dimensional stability, and comprehensive reliability. With the rapid development of power electronics, 5G communications, and new energy vehicles, performance requirements for PI frames will continue to increase, driving continuous innovation in material modification, precision molding, and functional integration technologies.
Note: The above data is based on industry standards and typical applications.
