PTFE Extruded /Molded Tube/Filled PTFE TUBE

Ⅰ、Features

Teflon extruded pipe and molded pipe using polytetrafluoroethylene suspension polymerization process. In the known plastic polytetrafluoroethylene has good chemical resistance and dielectric properties.

Ⅱ、Types and Specifications:

Ⅲ、Main Properties

Ⅳ、Applications

  Transmission of corrosive liquids or gases such as hydraulic fluid and fuel in the aerospace industry; high pressure air, fuel and hydraulic transmission in the automotive industry; delivery of chlorine, steam, acid-base organic compounds, etc. in the chemical industry; Purity fluid delivery. As PTFE has the best plastic in the high temperature, low corrosion, anti-aging, high insulation and non-stick advantages.

PTFE-Copper Powder Composite Tube Product Introduction

Product Overview

PTFE-Copper Powder Composite Tube is an innovative composite piping material manufactured through a specialized process combining Polytetrafluoroethylene (PTFE) with high-purity copper powder. This revolutionary material perfectly integrates the corrosion resistance of plastics with the thermal/electrical conductivity of metals, providing an innovative solution for thermal management and electrostatic protection in corrosive environments.

Core Advantages

· Dual Functionality: Thermal conductivity reaches 5-8 W/m·K (20 times higher than pure PTFE), while maintaining excellent anti-static properties

· Superior Corrosion Resistance: Withstands extreme corrosive media including 98% concentrated sulfuric acid and 40% hydrofluoric acid

· Broad Temperature Range: Long-term stable operation from -100℃ to +200℃, short-term resistance up to 250℃

· Safe & Reliable: Adjustable resistivity (10²-10⁶ Ω·cm), effectively eliminating electrostatic hazards

Key Parameters

Performance Indicator	Standard Type	Enhanced Type
Copper Powder Content	20-30%	30-40%
Burst Pressure	≥3 MPa	≥5 MPa
Thermal Expansion Coefficient	50-70×10⁻⁶/K	40-60×10⁻⁶/K
Surface Resistance	10³-10⁴ Ω	10²-10³ Ω

Product Series

· General Series: 20-25% copper powder, for conventional industrial applications

· High Thermal Conductivity Series: 30-40% copper powder, optimized for heat exchange systems

· Super Conductive Series: Gradient copper powder distribution, resistance <10 Ω·cm

· Food Grade: Compliant with FDA standards, suitable for food and pharmaceutical industries

Typical Applications

· Chemical Field: Heat exchange systems for highly corrosive media

· Electronics: Cooling pipelines for high-power components

· Explosion-proof Environments: Transport pipelines for flammable and explosive media

· Semiconductor: Precision cooling systems for process equipment

Quality Assurance

· Premium Materials: DuPont PTFE + 99.99% electrolytic copper powder

· Advanced Process: Isostatic pressing + program-controlled temperature sintering

· Rigorous Testing:

  · 100% conductivity/thermal performance testing

  · Ultrasonic non-destructive testing

  · 3x working pressure verification

· International Certifications: ASME, FDA, ATEX, RoHS

Key Performance Parameters

Indicator	Standard Type	Enhanced Type
Copper Powder Content	20-30 wt%	30-40 wt%
Burst Pressure	≥3 MPa (DN50)	≥5 MPa (DN50)
Thermal Expansion Coefficient	50-70×10⁻⁶/K	40-60×10⁻⁶/K
Surface Resistance	10³-10⁴ Ω	10²-10³ Ω

Product Series

· General Series: 20-25% copper powder, conventional industrial applications

· High Thermal Conductivity Series: 30-40% copper powder, specialized for heat exchange systems

· Super Conductive Series: Gradient copper powder distribution, resistance <10 Ω·cm

· Food Grade: Compliant with FDA 21 CFR 177.1550 standard

Typical Application Scenarios

· Chemical Heat Exchange: Reactor heat exchange tubes, condenser pipelines

· Electronics Heat Dissipation: Cooling systems for high-power devices

· Anti-static Systems: Powder transport pipelines, flammable media transport

· Semiconductor: Process equipment cooling pipelines

Basic Performance Parameters

Performance Indicator	20% Cu Content	30% Cu Content	Test Standard
Density (g/cm³)	2.4-2.6	2.8-3.0	ISO 1183
Tensile Strength (MPa)	18-22	15-18	ISO 527
Thermal Conductivity (W/m·K)	5-6	7-8	ASTM E1461
Volume Resistivity (Ω·cm)	10³-10⁴	10²-10³	IEC 60093
Thermal Expansion Coefficient (10⁻⁶/K)	50-70	40-60	ASTM D696

Product Specification Parameters

Parameter	Standard Range	High-Precision Custom Range	Tolerance Grade
Outer Diameter (mm)	6-150	3-300	±0.1% (≤50mm)
Wall Thickness (mm)	1-10	0.5-20	±5%
Cu Powder Distribution Uniformity (%)	≥95	≥98	EDS Area Scan
Straightness (mm/m)	≤2	≤1	ISO 2768

Process Parameters

Process Step	Key Parameter	Quality Control Point
Mixing	Copper Powder Particle Size 5-20 μm	Moisture Content <0.1%
Pre-forming	Pressure 50-70 MPa	Holding Time 30 min
Sintering	380℃±5℃/4-6h	Crystallinity 65-75%
Finishing	Turning Speed 500-800 rpm	Ra≤0.8 μm

Application Selection Guide

Application Scenario	Recommended Model	Key Parameter Configuration
Heat Exchanger Tubes	TCU-25	Copper Powder 25% + Wall Thickness 2mm
Anti-static Transport Pipes	TCU-35	Copper Powder 35% + Conductive Layer
Semiconductor Cooling	TCU-20-ULTRA	Ultra-high Purity Copper Powder (5N)
Food Grade Applications	TCU-22-FDA	FDA Certified Raw Materials

Innovative Technology Parameters

Technology Type	Technical Indicator	Performance Improvement
Nano-copper Composite	Add 5nm Copper Particles	Thermal Conductivity +40%
Gradient Composite	Radial Gradient of Cu Powder Content	Optimized Stress Distribution
Surface Modification	Micro-arc Oxidation Treatment	Wear Resistance +200%
Intelligent Monitoring	Embedded Temperature Sensor	Real-time Thermal Monitoring

Industry Certification Standards

Certification Type	Standard Number	Applicable Scope
Pressure Piping	ASME B31.3	Industrial Piping
Food Grade	FDA 21 CFR 177	Food Processing
Explosion-proof Certification	ATEX 2014/34/EU	Explosive Atmospheres
Environmental Certification	RoHS 2.0	General